MLCI Cautions Storage
1.The chip inductor shall be packaged in carrier tapes.
2.To keep storage place temperature from +5 to 35℃, humidity from 45 to 70% RH.
3.The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is
4.exposed to such atmospheres, the terminals will oxidize and solderability will be affected.
5.The solderability is assured for 12 months from our final inspection date if the above storage condition is followed.
Handling
Chip inductor should be handled with care to avoid contamination or damage. The use of vacuum pick-up or plastic tweezers is recommended for manual placement. Tape and reeled packages are suitable for automatic pick and placement machine.
Soldering Profile for SMT Process with SnPb Solder Patste.
The rate of preheat should not exceed 4℃/sec and a target of 2℃/sec is preheat.Ceramic chip components should be preheated to within 100 to 130℃ of the soldering.
Soldering Profile for SMT Process with Lead Free Solder Paste
The rate of preheat should not exceed 4℃/sec and a target of 2℃/sec is preheat.Ceramic chip components should be preheated to within 100 to 130℃ of the soldering.
Recommended Pad Dimensions
The rate of preheat should not exceed 4℃/sec and a target of 2℃/sec is preheat.Ceramic chip components should be preheated to within 100 to 130℃ of the soldering.
