Coating Inductor SPH series (high current) & SPN series
Features Small and low profile inductor It corresponds to high current Simple and original magnetic shield structure
Application
For Small DC/DC converter (HDD, DVC, DSC, LCD display, Notebook, Tablet, Bluetooth earphone, Cellular phones)
Specifications SPH/SPN series
Version : SPNH1208
Update: Aug. 2012
Molding Inductor SPM series (high current)
Features Shielded construction Frequency range up to 3.0MHz Lowest DCR/uH ,in this package size Handles high transient current spikes without saturation
Application
1. Notebook / Desktop applications
2. VGA card applications
3. DC-DC Converter applications
4. Low profile, high current power supplies
Specifications SPM series
Version : SPM1208
Update: Aug. 2012
Low Profile Power Inductor
Features Low profile less than 0.8 - 3.0mm (Compart and thin) Small size for LK.21/LK.31/LK.51/LK.70/LK.80 series Tape and reel packaging available, to be high satunation for surface mounting
Application
1. DC/DC converters module
2. DC/AC inverters for TFT LCD panels
3. Digital video/cameras & Digital Photo Frame
4. Cell phones, PDA, Notebook, LCD TV and Cam coder
5. Battery chargers/Hard desk driver
6. Small size communication equipment
7. Computer equipment & various modems etcs.
Features For L0.01~L0.07 Series / L0.11~L0.16 Series Inductance Range :From 1.0 to 1000uH Rated current :Up to 10 Amps
Application
1. Switching power supplies,chargers.
2. Notebook computer .
3. TFT displays, CCDS, PDAS.
4. DC /DC Converter.
5. DC /AC Inverter.
6. Computer equipment & Various, Modems,etc.
Features For high frequency application Standard EIA size – 0603(0201), 1005(0402), 1608(0603) Lead-free specification (Pass green policy) Tight tolerance physical dimensions Surface mounting applicability (Supports reflow soldering condition) Tight inductance tolerance, excellent Q and guaranteed SRF range High product quality and outstanding reliability. (Ceramic integrated structure)
Application For high frequency application : cellular phone, WLAN, PHS, EMI countermeasure in
High frequency circuits and computer communication etc.
Features High density packaging is possible. This series requires less space and has greater EMI suppression effects. Different types with the same shape are available. Excellent in physical properties, such as terminal strength, flexure strength, soldering resistance and solder ability. Applicable to both flow and reflow soldering.
Application 1. Computers and peripheral devices, personal computers, VCR and cameras.
2. Noise suppression in digital equipment, car stereo, car engines controllers and QA electronic instruments.
3. Communication equipment.
Small and low profile inductor
